Requisition ID: R10171769
• Category: Engineering
• Location: Apopka, Florida, United States of America
• Clearance Type: Interim Secret
• Telecommute: No- Teleworking not available for this position
• Shift: 1st Shift (United States of America)
• Travel Required: Yes, 10% of the Time
• Positions Available: 1
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. Northrop Grumman Mission Systems seeks a talented and motivated Microelectronics Associate Process Engineer for our Advanced Packaging Technology -Line in Apopka, Florida.
Northrop Grumman's semiconductor foundry, packaging, integration, and test lines have unique capabilities of supporting a range of production microelectronics and providing leading-edge technology development.
The Apopka Florida wafer bumping -Line will support flip chip, 2.5D, and 3D packaging for internal production customers as well as emerging technology programs.  The line will provide a range of bump compositions.  Techniques will include sputter, electro-plating, and solder-sphere transfer to support flip chip, 2.5D, and 3D packaging using 100 mm to 300mm wafers.  The devices supported in Apopka will also be subjected to singulation and die/wafer probe testing.
The Associate Process Engineer will support and sustain a wide range of wafer bumping processes.
Responsibilities include:

• Support multiple wafer bumping processes.
• Support development and leading the aspects of the qualification of new bump and micropump compositions and process flows.
• Working with cross-site program, test, and reliability teams to achieve package qualifications and troubleshoot manufacturing and development issues.
• Ability to understand program package requirements and support advisement on suitable bump metallurgies and process flows as applicable.
• Support as required technical interface activities between wafer bumping lines, site management, and internal programs.
• Troubleshoots existing processes to improve safety, quality, cost, and efficiency.
• incorporates engineering changes to work in process.
• Research and evaluate commercially available tools and equipment to support manufacturing processes.
• Coordinates with production on day-to-day activities. Assists in the resolution of processing issues.
Required Qualifications

• BS or graduate degree from an accredited college/university in Chemical Engineering, Materials, Chemistry, Physics, or related STEM discipline.
• In lieu of a college degree, 5 years of semiconductor cleanroom experience
• Experience in a manufacturing environment
• Strong leadership, communication, and problem-solving skills
• Must be a US Citizen and able to obtain and maintain a Secret clearance.
• Willingness to have position transition from 1st shift to 2nd Shift in the future.
Preferred Qualifications

• Experience using SPC and Six Sigma techniques.
• Prior experience with semiconductor-industry-capable process tools
• Understanding of UBM and solder bump metallurgy and how they impact package reliability.
• Experience with both lead and lead-free bump technologies.
• Experience in flip-chip, 2.5D, and 3D packaging.
MANUMS
Salary Range: $62,200 - $93,400
The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.
Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.
The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.PDN-9d133c1f-11ba-497b-9f71-b58ef064fabb